Teradek Bond-759 Bond HEVC Backpack Gold Mount with EU Nodes

• 1 x Backpack with Gold Mount
  
  
• 1 x Cube 755 HEVC/AVC Encoder
  
  
• 1 x Bond OLED Remote
  
  
• 2 x Antenna 2dBi Wifi 2.4/5.8GHz
  
  
• 1 x SDI BNC to BNC Cable
  
  
• 1 x Bond Expansion Module
  
  
• 1 x Quick Start Guide
  
  
• 4 x Teradek Nodes for your Region
  
  
• 8 x Antenna 2G/3G/4G Sma Mount
  
  
• 1 x Telna Sim Card1 x 2-pin to PTap 6.5in Cable
  
  
• 1 x 4-pin Connector to 4pin Connector 34inch cable

Node Europe/Asia 4-pin-4pin

Dimensions - [82.75 x 18.5 x 59.25 mm]

Construction
Milled Aluminum (Chassis), regulation compliant PCB
Mountability
1/4"-20 threaded hole,
2x 4-40 threaded holes,
Additional mounting options available

Temperature
Operating: -10ºC to 50ºC
Storage: -40ºC to 90ºC

Humidity
Operating: 5% to 95% (non-condensing)
Storage: Max. 90%

Interface 2 Status LEDs
Interface 4-pin to 4-pin connector

Lte
EU/Asia: LTE FDD Cat 4, Bands 1,3,5,7,8,20
EU/Asia: HSDPA Cat 24, HSUPA Cat 6, Bands
850/900/1900/2100
2x2 MIMO SMA

Band 17 (700 MHz), Band 13 (750 MHz)
Band 5 (850 MHz)
Band 4 (1700 MHz) Band 2 (1900 MHz)

Power Class
Class 3 23dBm LTE mode
Class 3 24 dBm for UMTS/HSDPA/HSUPA
mode
Data Rate
LTE cat. 4: up to 150 Mbps DL, 50 Mbps UL
HSDPA cat.14, up to 21 Mbps DL
HSUPA cat.6, up to 5.6 Mbps UL
Sim
Full size SIM

Power Input 2-Pin Connector, 5-28V
Battery None
Nominal Power Consumption 5W Max